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Manuscript Preparation Instructions


Paper Submission:  During the initial paper submission process via EDAS, the authors are required to make sure the pdf file and EDAS registration page of a paper have the same list of authors and the paper title, that is, please add all authors in EDAS during the submission process. Failure to comply with this rule, your paper may be withdrawn from the review process. On the other hand, the author list of an accepted paper can NOT be changed in the final manuscript.

All submissions should be written in English with a normal paper length of six (6) printed pages (10-point font) including figures  without incurring additional page charges. The authors may submit a long paper with a maximum paper length of nine (9) printed pages. Each additional page beyond page 6 incurs an additional page charge of USD100 per page. Papers exceeding 9 pages will not be accepted at EDAS, nor reviewed at all.

CCNC 2013 adopts a double blind review process to improve the publication quality of the paper. Explanation of double blind submission and review can be found at: http://www.cs.utexas.edu/users/mckinley/notes/blind.html.

To make your submission double-blind, please do not reveal the identity of any author in the text. For example, do not include author names, funding sources, or personal acknowledgments. You can add those after the paper is accepted, when preparing the final manuscript of the paper. Do not eliminate essential self-references or other references. However, limit self-references only to papers that are relevant for reviewing the submitted paper. Always use the third person when referring to your prior work. For example, if you are Smith write: ”We build on the prior work by Jones and Smith [JS 2003].” Do not reference technical reports (or URLs for downloading versions) of your submission, software, or publications. If you have a concurrent related submission, reference it as follows: ”Closely related, concurrently submitted work shows how to use this pointer analysis for testing [Anonymous 2007].” with the corresponding citation: “[Anonymous 2007] Under submission. Details omitted for double-blind reviewing.” Even following these guidelines, closely building on your own prior work may indirectly reveal your identity. Double blind is not perfect, just better.

Font size should be no smaller than 10 points. The three most important elements of manuscript layouts are:

1. Margins:

  US Letter A4
Top Margin 0.75 inch  19mm
Bottom Margin 1 inch   43 mm
Side Margins .625 inch  13 mm


When you upload your PDF, EDAS should report the margins are no less than 0.625x0.625x1x0.75 with a text region no more than 7.25 inches x 9.25 inches on a standard US Letter document (8.5 inches x 11 inches). The minimum line spacing should be 11pt. Of course, your margins and line spacing can be larger than this.

2. Manuscript should NOT have

·         Headers

·         Footers except for "Page number" information.

3. Pages in the manuscript should be numbered

·         Except the first page

·         Preferably at the top right or bottom center

·         Additions to IEEEtran template to achieve this are provided below. Please include these statements at the top of your at the top of your LaTeX file:

\documentclass[conference]{IEEEtran}
%% CCNC 2013 addition:
\makeatletter
\def\ps@headings{%
\def\@oddhead{\mbox{}\scriptsize\rightmark \hfil \thepage}%
\def\@evenhead{\scriptsize\thepage \hfil \leftmark\mbox{}}%
\def\@oddfoot{}%
\def\@evenfoot{}}
\makeatother
\pagestyle{headings}

You are free to use good judgment in the presentation of your information. These guidelines are meant only as helpful tools. However, basic adherence to layout specifications is expected.
 

  Templates  
Microsoft Word 97/2000
(DOC Format)
LaTeX
(Archive Contents)
LaTeX
(Bibliography Files)
US Letter Unix Unix
A4 Windows Window



LaTeX users: Note new LaTeX templates IEEEtran LaTeX Class (template) V1.7 packages and IEEEtran V1.12 BibTeX (bibliography) packages. Be sure to use the template's conference mode. See template documentation for details.

To create a PDF file on different platforms, please see the PDF Generation Instruction at https://www.fastlane.nsf.gov/NSFHelp/flashhelp/fastlane/FastLane_Help/generating_pdf_overview.htm (Courtesy: NSF Fastlane). To avoid printing problems due to missing fonts, please use Postscript Type 1 fonts and embed these fonts in the PDF file.

Only PDF files will be accepted for the review process and all submissions must be done through EDAS. Please contact  the Technical Program Chair, Jin Li, Li.Jin@microsoft.com  if you have any questions about submitting your manuscripts.

IMPORTANT IEEE POLICY ANNOUNCEMENT:

The IEEE reserves the right to exclude a paper from distribution after the conference (e.g., removal from IEEE Xplore®) if the paper is not presented at the conference.

Papers are reviewed on the basis that they do not contain plagiarized material and have not been submitted to any other conference at the same time (double submission). These matters are taken very seriously and the IEEE Communications society will take action against any author who has engaged in either practice.

IEEE Web Page on Plagiarism: http://www.ieee.org/web/publications/rights/Plagiarism_Guidelines_Intro.html

IEEE Web Page on Double Submission: http://www.ieee.org/web/publications/rights/Multi_Sub_Guidelines_Intro.html

PLEASE NOTE: To be published in the IEEE CCNC 2013 Conference Proceedings and IEEE Xplore®, an author of an accepted paper is required to register for the conference at the FULL or LIMITED (member or non-member) rate and must present the paper at the conference. Non-refundable registration fees must be paid prior to uploading the final IEEE formatted, publication-ready version of the paper. For authors with multiple accepted papers, one FULL or LIMITED registration is valid for up to 3 papers. Accepted papers will be published in the IEEE CCNC 2013 Conference Proceedings. Accepted and presented papers (both oral and poster) will be published in the IEEE CCNC 2013 Conference Proceedings and in IEEE Xplore®.



 
 


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